Semiconductor Packaging Process Tutorials, Training and Certification
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Semiconductor Packaging Process Tutorials, Training and Certification
This Semiconductor Packaging course teaches the fundamental materials and processes used in microelectronics manufacturing and visual inspection criteria. Learn more.
Nov 7, 2020
Microelectronics Projects
Hesse 653 Automated Wire Bonder (University of Glasgow) | Glasgow Microelectronics (meLAB)
Hesse 653 Automated Wire Bonder (University of Glasgow) | Glasgow Microelectronics (meLAB)
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Vinod Dham Centre of Excellence for Semiconductors & Microelectronics inaugurated in Delhi. Strong focus on talent development for India’s semiconductor ecosystem. ✅ Chips to Start-up program: - Over 1 lakh students (B-Tech/ M-Tech/ PhD) onboarded - 263 institutions supported with world-class EDA tools - 65 R&D projects at 113 organisations - SMART lab at Nielit, Calicut - 170 trainings by ChipIN centre ✅ 20 ASICs fabricated at SCL foundry & 14 ASICs sent for fabrication. | Ashwini Vaishnaw
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Vinod Dham Centre of Excellence for Semiconductors & Microelectronics inaugurated in Delhi. Strong focus on talent development for India’s semiconductor ecosystem. ✅ Chips to Start-up program: - Over 1 lakh students (B-Tech/ M-Tech/ PhD) onboarded - 263 institutions supported with world-class EDA tools - 65 R&D projects at 113 organisations - SMART lab at Nielit, Calicut - 170 trainings by ChipIN centre ✅ 20 ASICs fabricated at SCL foundry & 14 ASICs sent for fabrication. | Ashwini Vaishnaw
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