Abstract: In this article, the improvements in thermal performances of the SiC power module integrated with vapor chamber (VC) under modular multilevel converters (MMCs) working conditions are ...
Abstract: We develop a PCSEL-array module towards metal 3D printing applications. We develop a module with four 3-mm-diameter PCSELs, which are mounted on a heat sink in a $\mathbf{2}\times ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results