Abstract: A low-temperature annealing process for 4H-SiC/SiO2 stack in O2 ambient was found to annihilate the positive fixed charges induced by the interface nitridation process effectively, while ...
Abstract: In this work, a 300 mm wafer with Cu pads of 1 μm x 1 μm is used for a hybrid bonding process research. The Cu/SiO 2 layers were planarized by a three-platen CMP process using different ...
Why? Because sometimes you just don't want to deal with docker files, volume definitions, networks and docker registries. Since it's written in Go, Process Compose is a single binary file and has no ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback