Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

While dynamic modeling is arguably one of the most important technological developments for engineers in the last 50 years, many process control engineers are unable to use it. It requires proper time ...

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...

Aiming at the dynamic stall problem that restricts the improvement of aircraft maneuverability, a new dynamic stall control method based on leading-edge DSJ is proposed in this paper. The results show ...

Vacuum degassing processes in low carbon steel production improve material properties, with real-time gas analysis critical ...