As designs transition from 130nm to 90nm and below, designers must consider manufacturing effects early in the design cycle. Shrinking design nodes, larger designs, and expanding design complexity ...

Design technology has traditionally dealt with area, timing and power as its main objectives in the past. While these objectives continue to be essential, the industry is increasingly focusing on a ...

In moving to nanometer process technologies at 130 nm and below, semiconductor designers face a variety of physical and electrical effects that can significantly degrade circuit performance. For these ...

Diagnosis-driven yield analysis identifies the cause of systematic yield loss to speed yield ramp on new processes and improves yield on mature processes. Finding the root cause of yield loss is ...

Detection and monitoring of the yield loss mechanisms and defects in product chips have been a subject of extensive efforts, resulting in multiple useful Design-for-Manufacturing (DFM) and ...