Semiconductor process engineers would love to develop successful process recipes without the guesswork of repeated wafer testing. Unfortunately, developing a successful process can’t be done without ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

Keeping an IC cool takes on new meaning when power dissipation exceeds 150 watts. Innovative electrical and mechanical solutions to new wafer testing challenges continue to be developed. For example, ...