Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Device test times also are rising dramatically. Longer test times are driven by higher levels of embedded memory, higher functionality, higher quality requirements, and the need to move more tests to ...
Test is a dirty business. It can contaminate a unit or wafer, or the test hardware, which in turn can cause problems in the field. While this has not gone unnoticed, particularly as costs rise due to ...
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