Dublin, Jan. 26, 2024 (GLOBE NEWSWIRE) -- The "Wafer Processing Equipment Global Market Report 2024" report has been added to ResearchAndMarkets.com's offering. The global market for wafer processing ...

Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

New York, May 19, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO:6503) announced today that the company has completed installation of its first 12-inch silicon wafer processing line at its Power Device ...

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...

Trade body, VDMA has made key updates to the 10th edition of the International Technology Roadmap for Photovoltaics (ITRPV) to incorporate the ongoing and rapidly changing wafer size transition as ...

Capacity for 200mm wafers forecast to slip more than 10 points during same period. July 03, 2013 -- Since 2008, the majority of integrated circuit production has taken place on 300mm wafers. In terms ...

ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...

SANTA CLARA, Calif. — Applied Materials Inc. here today will attempt to turn the wafer cleaning equipment business upside down, by entering this market with a revolutionary, single-wafer system for ...

Rapidus is trying the revolutionary single-wafer processing procedure to significantly reduce cycle time for chipmaking on its way to mass-produce 2nm chips. Save my User ID and Password Some ...

International Rectifier has commenced initial production at its new state of the art ultra thin wafer processing facility in Singapore. Dubbed IRSG, the 60,000sq ft manufacturing site will be used to ...

RTP is a semiconductor manufacturing technique in which silicon wafers are heated at temperatures above 1000 o C using lasers or high-intensity lamps for a few seconds. During the cooling of the ...