Electronic Design

Ring-Oscillator Process Monitors for Wafer-Level CMOS Screening

Ring-oscillator process monitors give production test teams a fast on-die frequency measurement for identifying CMOS process ...
Electronics Weekly

Imec develops die-to-wafer bond process with 2µm pad pitch

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
Digi Times

Boosting both capacity and yield, iST offers complete backend wafer process services for power semiconductor devices

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...
AZOM

Curved Shapes with Mask Wafer Co-Optimization

One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...
Semiconductor Engineering

Laser Ablation Dicing Revolutionizes Ultra-Thin Wafer Saws Beyond The Capability Of Blade Dicing

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...