Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...

The new CSP is entering technology qualification in the June quarter with production release expected in the second half of calendar 2021. The first use of this new CSP is for a custom ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

A technical paper titled “Review of virtual wafer process modeling and metrology for advanced technology development” was published by researchers at Coventor Inc., Lam Research. “Semiconductor logic ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

Audio Pixels Holdings Limited (ASX: AKP) has announced a significant technological breakthrough in the independent ...

To support McCrometer’s European customers, the high-accuracy, virtually no-maintenance Wafer-Cone Flow Meter meets the requirements of the European Community’s Pressure Equipment Directive (PED) ...

When we refer to surface charge analysis, we consider the charge at the interface between a material and a surrounding aqueous solution. With respect to the semiconductor field, knowing the charge at ...

The first WLCSP device is expected to be technology qualified later this quarter with production release expected in the June 2021 quarter. The new package offers a significantly smaller filter ...