FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...

The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of UV and direct thermal exposure that significantly reduces process cycle time.

(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...

When we refer to surface charge analysis, we consider the charge at the interface between a material and a surrounding aqueous solution. With respect to the semiconductor field, knowing the charge at ...