A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for ...

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...

FREMONT, Calif., Oct. 06, 2022 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has released ...

ficonTEC’s new WaferLine Test (WLT) product line is specially designed as a versatile, fully automatable test-&-measurement system platform for wafer-level device test. They systems provide fully ...

As a partner for the semiconductor equipment industry, as well as test providers and users, Jenoptik is offering a novel optical solution for integration into electrical test cards. The ultra-fast ...

The continuing advances in semiconductor functionality, density, and chip-level integration are generating new challenges in accessing devices for test and controlling the physical and electrical ...

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...

SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...