In order to support the growth of the Photonic Integrated Circuit (PIC) market and be able to timely serve the scaling of its customers when moving to engineering and pilot production stages, VLC ...

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip™ module—the world’s first ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVMed® OCHTA camera module with quadruple the ...

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...

Himax Technologies, Inc. is a semiconductor solution provider dedicated to display imaging processing technologies. It operates through the Driver Integrated Circuit and Non-Driver Products segments.

TFI Securities analyst Ming-Chi Kuo said in a post on Medium that he expects Himax to leverage its WFO technology and strong partnership with Fiber Optics Communications to enter the supply chain for ...

Himax Technologies, Inc. is a semiconductor solution provider dedicated to display imaging processing technologies. It operates through the Driver Integrated Circuit and Non-Driver Products segments.