Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

Crystalline quartz films grown on four-inch silicon wafers detect Chikungunya virus at sensitivities surpassing standard ...

Corning’s Michigan ingot and wafer plant puts it in a strong position to corner the market for US-made, FEOC compliant products. Image: Corning. At the end of October, Corning announced that it had ...

Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...

Silicon carbide (SiC) has arrived, and it’s a big deal. It was written all over APEC 2023 show with a string attached: the cost of a SiC device is significantly higher than its silicon counterpart.