Advances in both the physical properties of chips and in design tools allow us build huge systems into “just a few” square millimeters. The problem is that modeling these systems at the ...
IP companies have heralded a new age in platform-based design for years – ever since semiconductor integration capacity reached the point where entire systems could theoretically be integrated into a ...
SAN JOSE, Calif.--(BUSINESS WIRE)--June 6, 2005--The Open SystemC Initiative (OSCI) today announced the delivery of the SystemC(TM) Transaction-level Modeling (TLM) Standard 1.0. The availability of a ...
Transaction-level modeling (TLM) verification methodologies are propagating down from power users, such as large systems houses and integrated device manufacturers, to the broader design community. As ...
Much anticipated TLM-2.0 provides essential framework for standards-based ESL design ANAHEIM, Calif.-- June 09, 2008-- The Open SystemC Initiative (OSCI), an independent non-profit organization ...
With design complexity always on the rise and an increasing amount of embedded software encapsulation in designs today, engineering teams need to be concerned with power consumption in the initial ...
The Open SystemC Initiative (OSCI) has delivered its Draft SystemC Transaction-Level Modeling (TLM) 2.0 kit, containing proposed extensions to OSCI TLM application programming interface (API) ...
SLD: How long has NXP designed at the system-level for production chips? Frans Theeuwen: It depends on what you call ‘system-level design.’ We have been doing hardware/software co-verification ...
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