TMCnet

Ezurio to Power the Edge with Carbon AM62: A Secure and Powerful OSM-MF SOM Based on TI AM62x SoC with Advanced Graphics and Built in TI CC3351 Wireless Co…

AKRON, Ohio, Feb. 10, 2026 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the Carbon AM62 OSM-MF ...
EDN

TI unveils power modules with new packaging technology

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
Electronic Design

Magnetic Packaging Helps Slash DC-DC Module Size Even Further

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...
Nasdaq

Chicony Power and TI join forces to bring GaN technology to next-generation energy-efficient laptop power adapter

Chicony Power achieved high power density and up to 94% efficiency in their latest laptop power adapter design backed by TI's dual-chip GaN active clamp flyback solution DALLAS, Dec. 14, 2022 ...
EDN

TI launches power management ICs for data centers

Texas Instruments Inc. (TI) has announced new power-management chips to support high-performance computing and artificial intelligence (AI) in data centers that require higher-power density and ...