Contemporary academic institutions face many challenges when planning new technology or applications like hybrid learning. Overcoming resistance to change and fostering an environment that embraces ...

SAN FRANCISCO--(BUSINESS WIRE)--Armis, the cyber exposure management & security company, today announced that it has added 10 global technology integration partners over the past quarter. These ...

Rebecca Torchia is a web editor for EdTech: Focus on K–12. Previously, she has produced podcasts and written for several publications in Maryland, Washington, D.C., and her hometown of Pittsburgh.

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Educators must know how to use their tech tools before they can teach with them. Professional development can help schools close the digital design divide called out in the National Educational ...