LONDON — Alchimer SA (Massy, France), a provider of wet deposition processes for semiconductor interconnects and 3-D through-silicon vias (TSV), has said it has found a way to eliminate the seed-layer ...

PARIS — Alchimer SA, France-based provider of wet deposition processes for interconnections in 3D packaging applications, announced it has introduced a deposition process that is said to reduce cost ...

Deep Reactive Ion Etch (DRIE) processes used to form through silicon vias (TSVs) achieve high aspect ratios by depositing polymer on the vertical sidewalls of the features. This polymer material must ...

Hsinchu, Taiwan, July 20, 2015 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has entered volume production for ...

FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE:RTEC) announced today the sale of its first NSX ® 320 TSV Metrology System to CEA-Leti, a leading research organization based in ...

Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved ...

March 9, 2014. Rudolph Technologies Inc. announced the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--The international EMC-3D semiconductor equipment and materials consortium today announced that Applied Materials, Inc. (Nasdaq:AMAT) has joined the organization.

Samsung Electronics says its new 12nm-Class 32Gb DDR5 DRAM will allow for the creation of 128GB DRAM modules without the TSV process and could lead to 1TB DRAM modules in the future. With companies ...