Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, ...

Northwestern Engineering researchers have developed the first full, three-dimensional (3D), dynamic simulation of a rat’s complete whisker system, offering rare, realistic insight into how rats obtain ...

AI-powered chatbots. Robotic manufacturing equipment. Self-driving cars. Bandwidth-intensive applications like these are flourishing—and driving the move from monolithic system-on-chips (SoCs) to ...

How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...

Researchers have developed a compact and lightweight single-photon airborne lidar system that can acquire high-resolution 3D images with a low-power laser. This advance could make single-photon lidar ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Many designs involve multiple engineering domains. For example, hybrid vehicles balance engine performance with emissions limits; UAVs balance thermal limitations on their batteries with ...

Engineers have developed the first full, three-dimensional (3D), dynamic simulation of a rat's complete whisker system, offering rare, realistic insight into how rats obtain tactile information.