Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications Designers of advanced IC packages face many ...
PARIS — Taiwan's Advanced Semiconductor Engineering (ASE) Inc. announced it has licensed Apache Design Solutions’ products for chip-package-system (CPS) convergence. ASE said it is using Apache's CPS ...
The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems The Tempus Timing ...
The best representatives of the present generation of system analysis tools identify problems and show us which hardware is impacted. What we really need however, are tools that go one step beyond, ...
[This article was first published in Army Sustainment Professional Bulletin, which was then called Army Logistician, volume 2, number 2 (March–April 1970), pages 4–8.] IN AN AGE when weapon system ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design ...
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