Electronic Design

Center-Probe Test Socket Handles Devices Up To 13 mm

A center-probe test socket for devices up to 13 mm wide, with pitches of 0.50 mm and higher, operates from 1 to 10 GHz. Designed for CSP, MicroBGA, MLF, QFN, DSP, LGA ...
EDN

Aries Electronics’ Protect-A-Probe anti-diffusion gold coating is now available for all spring probes

Bristol, PA. March 10 – Aries Electronics, a U.S. manufacturer of standard, programmed, and custom interconnection products, burn-in and test sockets used worldwide, today introduced, at the BiTS ...
EDN

Socket vendors take on 0.5-mm pitch

The single biggest headache for test engineers is the ever-finer pitch of ball grid array and chip-scale package sockets. The migraines really begin at fine pitches of 0.5 mm, a point where shrinking ...
Electronic Design

Packaging & Interconnects: RF Center-Probe Test Socket Accepts 14- To 27-mm2 Devices

A new RF center-probe test socket accepts devices from 14 to 27 mm2. It's designed for pitches down to 0.5 mm and speeds from 1 to over 10 GHz in CSPs, MicroBGAs, MLFs, QFNs, and LGAs. A four-point ...