ROME, Sept. 19, 2018 (GLOBE NEWSWIRE) -- The DSFP (Dual Small Form-Factor Pluggable) MSA (Multi-Source Agreement) Group has developed Rev. 1.0 Hardware Specification for the DSFP form factor module.
Molex Announces Quad Small Form-factor Pluggable Plus (QSFP+) Solution for High-Density Applications
LISLE, Ill.--(BUSINESS WIRE)--Molex Incorporated (NASDAQ: MOLX) and (NASDAQ: MOLXA) introduces the Quad Small Form-factor Pluggable Plus (QSFP+) interconnect solution designed for a multitude of ...
CAMBRIDGE, UK — Molex introduces the Quad Small Form-factor Pluggable Plus (QSFP+) solution for high-density applications, combining optimal real-estate savings, power and port density. The (QSFP+) ...
LOS ANGELES--(BUSINESS WIRE)--The Octal Small Form Factor Pluggable (OSFP) Multi Source Agreement (MSA) Group has released the electrical and mechanical specifications for the new OSFP form factor. A ...
Sunnyvale, Calif. — Fujitsu Components America, Inc. today announced the release of a copper electrical transceiver module compliant with the X2 multi-source agreement (MSA) specification Rev. 1.0b.
Developers of high-performance computing systems, data centers and other ultra-high-throughput networks now have a new interconnect option for SFP+ applications, an enhanced version of the small form ...
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