Thermo-compression processing optimizes Cu/SiC composites, improving strength and toughness by improving particle ...
For the first time, researchers have created a nanocomposite of ceramics and a two-dimensional material, opening the door for new designs of nanocomposites with such applications as solid-state ...
Ultrasonic-assisted hot pressing (UAHP) has shown significant potential in enhancing both densification and mechanical ...
Partnership underscores both companies’ commitment to increase the adoption of additive manufacturing through collaborations that deliver orders of magnitude productivity improvements and sustainable ...
NORTHBROOK, Ill.--(BUSINESS WIRE)--M. Holland Company, a leading distributor of thermoplastic resins and 3D printing materials, announced its 3D Printing group has partnered with Advanced Laser ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
Feng's team from Tsinghua University has reported an innovative study on optimizing the thermoelectric performance of SnSe via liquid phase sintering.
Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...
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