The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.
Round led by Equirus Innovatex Fund and Artha Venture Fund, with participation from IvyCap Ventures, PointOne Capital, CIIE ...
Copper (Cu) foil, with its exceptional electrical and thermal conductivity, serves as a foundational material for integrated circuits, high-frequency communication, and advanced energy technologies.
Researchers from Huazhong University of Science and Technology and Hebei University have optimized the nucleation process by regulating the interactions between the epitaxial layer and the substrate.
Raana Semiconductors Pvt. Ltd. (RSPL), an India-based company specializing in crystal growth systems and single-crystal ...
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