Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

KLAC rides 70% systems revenue surge on advanced packaging and AI chip demand, eyes mid-teen growth in 2026 despite margin ...

Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Glass Interposers Market Poised for Strong Growth as Advanced Semiconductor Packaging and High-Performance Computing Demand Accelerates: Verified Market Research (R) The global Glass Interposers ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...

(RTTNews) - SK Hynix Inc. (HXSCL), a South Korean semiconductor company, Tuesday announced its plan to invest 19 trillion Won in a new advanced packaging fab, Package & Test or P&T7. The investment ...