Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...