SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...

The AONA66916 Power MOSFET in AOS’ new top-exposed DFN 5 x 6 achieves industry leading thermal performance to enable cooler, more reliable designs SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Kaynes has also forged a significant partnership with global industrial software giant Siemens to enhance its system and package design capabilities, Panicker added. Under the collaboration, Kaynes ...

Siemens EDA announced that Toshiba Electronic Devices & Storage Corp. has introduced Siemens’ electronic design automation (EDA) software to enhance its power devices and analog semiconductor ...

Navitas Semiconductor, a major gallium nitride (GaN) power device supplier, showcased its latest offerings at CES 2023 in Las Vegas. These GaN-based devices spanned from 20-W mobile phone chargers to ...

Plano, Texas, USA -- Siemens, a leading technology company, announced today that Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has introduced Siemens’ electronic design automation (EDA) ...