Chip designs are busting out beyond the reticle limits of lithography machines, making chiplets and high-bandwidth, in-package die-to-die interconnects inevitable. And AI training workloads are ...

Artificial intelligence (AI) workloads are very different from those traditionally run inside of data centers, and while the current infrastructure can accommodate those needs, there is a constant ...

ST. LOUIS – AI-serving scale-up and scale-out architectures have become central to serving growing data center demands, with Broadcom one of many touting open interconnection models as being ...

HPE says its implementation of AMD’s ‘Helios’ rack-scale platform will include what it’s calling the ‘first scale-up switch to deliver optimized performance for AI workloads over standard Ethernet,’ ...