Part of ST’s strategic initiative on heterogeneous integration, contributing to technology roadmap on RF, analog, power and digital products Geneva, Switzerland, September 17, 2025 -- ...

STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with plans to commence ...

Multi-disciplinary team to further develop innovative approach to chip packaging and test manufacturing technology boosting efficiency and flexibility Part of ST’s strategic initiative on ...

Geneva, Switzerland, September 17, 2025 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details ...