As technology nodes shrink to 90 nanometers and below, chips become much more difficult to manufacture. In-die process variations increase substantially at 90 nm — even more at 65 nm. If these effects ...

As DRAM technologies scale to increasingly tighter pitches, the patterning requirements exceed the limits of conventional single-exposure DUV lithography. In advanced nodes such as D1b (1-beta), ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...

Global process owners should be notified of any change to a process variation, enabling them to retain oversight and control. 3. Compare and report Manufacturers must have the ability to compare and ...

In a recent study done by McKinsey and IDC, we see that physical design and verification costs are increasing exponentially with shrinking transistor sizes. As figure 1 shows, physical design (PD) and ...

In this interview, learn how Raman spectroscopy is used as a Process Analytical Technology (PAT) in bioreactor monitoring and control for cultivated meat production. Why look at different ways to ...