The new EPLAN Platform version 2.7 features bi-directional connections to two more automation technology solutions – Siemens’ TIA Portal and Melsoft IQ by Mitsubishi. It’s another expansion of EPLAN’s ...
WEST LAFAYETTE, Ind., Oct. 14, 2025 /PRNewswire/ -- Top-tier U.S. education meets top European tech to shape the future of industry. Purdue Polytechnic, one of Purdue University's largest colleges, ...
Rockwell Automation Highlights Integrated Digital Packaging and Production at Interpack 2026. 11/05/2026 Rockwell Automation. Joint showcase with Eplan and autonox Robotics demons ...