More than ever, power integrity is vital in the successful creation of today's system-on-a-chip (SoC) designs. That's because e xcessive rail voltage drop ( IR drop) and ground bounce can create ...

Efinix high-performance Titanium field-programmable gate arrays (FPGAs) are custom-tailored for the computing demands of mainstream applications, targeting markets from intelligent edge devices to ...

Band Power Side-Channel Detection for Semiconductor Supply Chain Integrity at Scale” was published by researchers at Cornell ...

The CST PCB Studio power integrity solver is based on a special 3D FEM approach, that can calculate accurate impedance profiles within a full 3D simulation. The power integrity solver is integrated in ...

Partnership addresses the needs of hardware engineers facing reliable power distribution problems during printed circuit board (PCB) design and layout Electromagnetic (EM) simulation technology ...

The Power Integrity Advance module ensures correct behavior of power distribution systems embedded within CADSTAR 13.0 design flow. It conducts EMC analysis and ac and dc power integrity analysis to ...

For system-on-a-chip designs at 90 and 65 nm, dynamic noise greatly exacerbates the challenge of timing signoff. To accurately examine noise effects, designers need tools that provide an accurate ...

Totem-SC delivers next-generation power integrity analysis for analog, mixed-signal, memory, and image sensor designs. PathFinder-SC delivers advanced semiconductor reliability analysis for all ...

For many years, power systems could be easily boiled down to a discussion of volts and amps. But for the past decade, the move to higher operating frequencies has brought another wrinkle to the power ...

For scalable electromagnetic analysis, Ansys is introducing HFSS-IC Pro, a new addition to the HFSS-IC product family. HFSS-IC Pro is certified for modeling on-chip electromagnetic integrity in radio ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...