The House Transportation and Infrastructure Committee will vote on the legislation tomorrow. House lawmakers are poised to mark up an expansive water infrastructure bill this week that includes a ...

US storage and inverter specialist Yotta Energy says its new package has several advantages compared to conventional C&I solar storage solutions. For example, the design cuts out the need for a ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

Memory backend specialist Powertech Technology (PTI) is set to move its FoPLP (fan-out panel level package) technology into volume production starting early 2022, according to company chairman DK Tsai ...

Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level package) process, ...

Semes, a semiconductor equipment company, said on the 16th that it has developed for mass production, for the first time in Korea, the TEPAS100, a sorter for large semiconductor panel-level package ...