Joint Development Agreement builds on ongoing collaboration with Manz Asia As demand for AI computing accelerates, advances in 12" wafer-level packaging and large-area panel packaging could offer a ...

Sustainable packaging is becoming a central focus for tech companies aiming to reduce environmental impact while maintaining product protection. Innovations like fiber-based materials, compostable ...

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher ...

Amazon is using AI to cut the amount of packaging materials it uses. Amazon ships 20 million packages a day in 19 countries, requiring an astronomical amount of paper, cardboard and plastic packaging.

Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications ...

ANN ARBOR, Mich.--(BUSINESS WIRE)--Amcor (NYSE: AMCR, ASX: AMC), a global leader in developing and producing responsible packaging solutions, today announced its 2025 Bottles of the Year, in ...