Joint Development Agreement builds on ongoing collaboration with Manz Asia As demand for AI computing accelerates, advances in 12" wafer-level packaging and large-area panel packaging could offer a ...

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. By Don Clark Reporting from ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Sustainable packaging is becoming a central focus for tech companies aiming to reduce environmental impact while maintaining product protection. Innovations like fiber-based materials, compostable ...

SK Hynix said the new facility would help it meet growing demand for memory chips. The $13 billion investment will build on its existing production in Cheongju. According to industry projections cited ...

The market size of next-generation thermal interface materials TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036 As semiconductor packaging surges ...

Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications ...

Automotive processors are rapidly adopting advanced process nodes. NXP announced the development of 5 nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5 nm technology during ...

Product packaging is more than just a practical choice—it plays a critical role in shaping customers’ perception and memory of the product and the business behind it. Carefully chosen, smart packaging ...