AI helps packaging teams design faster, use less material and improve performance through data-driven modelling, simulation and optimisation tools.

The Turbo Package Analyzer TPA v5 IC packaging tool features a new automation, design flow, and simulation capability needed to extract the electrical characteristics of complex high-performance BGA ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

Semiconductor engineering teams have long relied on an iterative simulation workflow: define the scenario, prepare the model, ...