IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

What do you think packaging design will look like in 2024? In the next year, packaging design will continue to evolve and surpass the limitations imposed by traditional shelf-space categories. With ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Dr. Steen Tjarks is the CEO at T&T Design, a global packaging and artwork agency that specializes in private label. Private-label products have seen significant growth globally, and I see packaging ...

Dezeen promotion: packaging for children's pens and a make-up set designed to look like an egg carton are among the winners in the Packaging Design category of the 2021 iF Design Award. The iF Design ...