SANTA CLARA, Calif., Sept. 5, 2017 /PRNewswire/ -- AnaGlobe Technology, Inc., a leader in layout integration solutions, will announce a unified chip-package layout solution, with features and extended ...
I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
With process nodes and die sizes shrinking, the number of consumer products incorporating ICs with flip-chip packaging is growing. Unfortunately, flip-chip package manufacturing rules have not kept ...
The true-impedance-profile is very powerful because it opens up other interesting venues for FA on electronic packages. For example, because the true-impedance-profile represents an exact signature of ...
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