Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

The vise is closing down on design departments.Manufacturers want more capabilitiesin their products than ever before. It’simperative for manufacturers to remaincompetitive. Marketing, meanwhile,wants ...

SANTA CLARA, Calif., Sept. 5, 2017 /PRNewswire/ -- AnaGlobe Technology, Inc., a leader in layout integration solutions, will announce a unified chip-package layout solution, with features and extended ...

In today’s ever-shrinking IC package design cycles, it is almost imperative that we catch and correct routing issues as early as possible, which makes simulation an integral part of the design cycle.

Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO). Photonic IC packaging ...

This file type includes high resolution graphics and schematics when applicable. In high-performance semiconductors, the back-end-of-line (BEOL) interconnect pitch has been shrinking for decades ...

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...