This paper describes the development of a Multiprocessor System-on-Chip (MPSoC) with a novel interconnect architecture and an enhanced compiler support for programmability. Our MPSoC programming ...
In this paper, we describe the design flow, architecture and implementation of our 3D multiprocessor with NoC. The design based on 16 processors communicating using a 4x2x2 mesh NoC spread on two ...
Interconnect mechanisms are application-specific and represent a significant part of a design's value. Being able to capture system-level processor interactions is key to validating your system. You ...
LEUVEN, Belgium — Research institute IMEC, announced that Japanese chipmaker Toshiba Corp. has licensed IMEC technology to help it design power-efficient single- and multiprocessor wireless baseband ...
Two processors can work better than one when they're tuned to a particular application area. Tensilica's new Xtensa-V architecture makes this possible for any number ...
Last month -- last month-- Samsung launched a 30TB SSD with one of the highest single-drive capacities we've yet seen. Seagate launched a 60TB SSD even earlier, though that appears to have been more a ...
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