As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not feasible to fit everything onto a single planar die. But determining when to ...

Wafer inspection, the science of finding defects on a wafer, is becoming more challenging and costly at each node. In fact, the ability to detect sub-30nm defects is challenging with today’s ...

With an abrupt rise in demand for Drone Solutions and Services, Indian Institute of Drones has launched a brand new training program called Multi-Rotor Drone Engineering Course. There is a ponderous ...

With an eye toward developing more stable structures capable of withstanding harsh environmental conditions—including those that future astronauts will find on Mars—researchers in Northwestern ...

Leading edtch platform Interview Kickstart launches new Agentic AI Course for Developers, Engineers and Managers to address ...