The micro/nano metal pattern formation is a key step in the assembly of various devices. However, ex situ approaches of metal patterning limited their industrial applications due to the poor stability ...

Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

Self-aligned lithographic process techniques are playing an increasingly important role in advanced technology nodes. Even with the growing use of extreme ultraviolet (EUV) lithography, ...

Pouring molten metal into three-dimensional molds to make metal parts is the basis behind both sand and investment casting. But there are significant differences between these two methods. In sand ...

This file type includes high-resolution graphics and schematics when applicable. Sand casting and investment casting are methods of creating metal parts by pouring molten metal into three-dimensional ...