At the start of 2025, during the annual CES event, AMD launched the successors to its popular Ryzen Z1 and Z1 Extreme APUs. These all-in-one CPU+GPU chips have been powering the very best handheld ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry’s leading HBM4E Memory Controller IP, ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...

The pace of AI innovation continues to expose a painful reality. Compute keeps scaling, but memory bandwidth remains one of the hardest bottlenecks to remove. As AI models grow larger and more complex ...

To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models ...

The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...

Memory limitations have blindsided many cloud users. It’s crucial for enterprises to expand their focus beyond GPUs and for providers to fix memory problems to keep AI performance on track. Most of us ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...

Agilex 7 FPGA M-Series Optimized to Reduce Memory Bottlenecks in AI and Data-intensive Applications SAN JOSE, Calif.--(BUSINESS WIRE)-- Altera Corporation, a leader in FPGA innovations, today ...

Google researchers have warned that large language model (LLM) inference is hitting a wall amid fundamental problems with memory and networking problems, not compute. In a paper authored by ...