Memory chip costs are up as AI companies gobble up the hot commodity. Consumer electronics companies like Dell and HP are ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now ...

Memory chips used to be considered low-margin commodity products. Now the industry can’t make enough to satisfy data centers’ hunger.

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

(CNN) — The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth ...

Vaishnaw indicated that India’s semiconductor ambitions are expanding beyond assembly and packaging into deeper technology ...

MU's surging AI memory demand is driving gross margins higher, with Q2 guidance of 68% points for further expansion.

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

It could allow Sony’s next-generation console to better support more complex game worlds and higher-resolution textures.

A new technical paper titled “Pushing the Memory Bandwidth Wall with CXL-enabled Idle I/O Bandwidth Harvesting” was published by researchers at Georgia Institute of Technology. “The continual increase ...