Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs.

PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...

Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The three innermost leaves contain three basic bistable units. The intermediate ring describes the basic preparation methods of multistable metamaterials: 3D printing (DIW, FDM, SLA, PolyJet, PBF, ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

Remember when assembly was a predominately manual process? We still have pictures from installations in the 1980s showcasing this method of assembly operations. Lines of manual production systems with ...

The Design & Manufacturing (DM) emphasis in the Department of Mechanical Engineering allows students to develop abilities and skills in mechanical design and aspects of manufacturing in achieving ...