In the spring, Reuters broke the news that Nvidia and Broadcom were testing Intel’s 18A process for chip production, but in a profile today of Intel CEO Lip-Bu Tan, the outlet now says Nvidia’s test ...

Intel has a lot riding on “18A,” its next-generation manufacturing process for silicon chips that the company claims will help it catch up to the lead that competitors like TSMC have built up over the ...

A study has developed an innovative method that overcomes the limitations of traditional additive manufacturing (3D printing), significantly simplifying and accelerating the production of ...

SAN FRANCISCO/SINGAPORE, March 3 (Reuters) - Chip designers Nvidia (NVDA.O), opens new tab and Broadcom (AVGO.O), opens new tab are running manufacturing tests with Intel (INTC.O), opens new tab, two ...

What is Pharma 4.0? The term Industry 4.0 refers to the fourth industrial revolution, associated with the application of advanced technologies that have dramatically changed the landscape of ...

Spring-loaded plungers use a spring and a plunger (or ball tip) to exert a precise and repeatable force. They are a better option than having engineers cobble together an assembly that uses a simple, ...

Andreas Eschbach is the founder and CEO of eschbach, a software company that helps production teams work smarter and enhance collaboration. Manufacturers are quickly understanding the strategic ...

At its core business process management is the administrative activities aimed at (1) defining a process, (2) establishing responsibilities, (3) evaluating process performance and (4) identifying ...

Process development is the exercise of creating new and improved manufacturing methods, optimizing them in terms of time and financial efficiency while maintaining regulatory compliance and product ...

The gate-all-around (GAA) semiconductor manufacturing process, also known as gate-all-around field-effect transistor (GAA-FET) technology, defies the performance limitations of FinFET by reducing the ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...