An improved understanding of major packaging process elements - coupled with the appropriate perspective on manufacturing techniques - reduces product failure and risk management for MEMS packaging.

Cary, N.C. and Pescara, Italy — Coventor Inc. in partnership with MEM Research offers a new 2.5D and 3D electromagnetic (EM) technology for simulation of MEMS devices and other micro systems.

In this paper a method for dynamic fault injection and fault simulation as well as its application to MEMS based sensor systems is described. The prerequisite for this approach is the availability of ...

The MEMS + 2.0 design suite includes tight integration and simulation within the widely used Simulink environment from MathWorks. In addition, it improves simulation performance within the Cadence ...

Modelling and simulation (M&S) is used by engineers to accurately model and analyse MEMS devices for better designs. In this eBook, we share the stories of four teams from around the world that used ...

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved. But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a ...