TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

This family of lead-frame packages has been extended to include dual-sided units. Said to combine the performance of array packages with the lower cost of lead frames, the dual, fine-pitch, no-lead ...

Australian technology firm Lednium has developed a domed lead-frame package to improve light distribution in LED lighting. “It is a natural progression when creating a source of Illumination from what ...

Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...

Dai Nippon Printing (DNP) is claiming to have developed a lead frame for the thinnest chip package yet. “Using this lead frame it has become possible to achieve a semiconductor package with a ...

Housed in a micro lead-frame package (MLP) measuring just 3 mm square, the C8051F300 flash memory microcontroller (MCU) packs a CPU, flash memory and an A/D converter. The pipelined 8051 CPU delivers ...

MarketResearch.biz announces publication of its most recently generated research report titled, "Global Lead Frame Market by Type, By Application, and Region/Country - Global Forecast to 2026.", which ...

As circuits become faster, more concern needs to be focused on packaging and interconnects in order to fully utilize device performance. One area of concern is with the package leads between the chip ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...