Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

DUBLIN--(BUSINESS WIRE)--The "Advanced IC Packaging Technologies, Materials and Markets - 2017 Edition" report has been added to Research and Markets' offering. Advanced IC Packaging Technologies, ...

As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to ...

Dublin, March 11, 2020 (GLOBE NEWSWIRE) -- The "The Worldwide Conventional and Advanced Packaging Market for IC Devices" report has been added to ResearchAndMarkets.com's offering. Report Highlights ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development Agreement" to ...

The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...