Despite a long list of issues plaguing chip giant Intel (NASDAQ: INTC), the company has made meaningful progress catching up to TSMC in semiconductor manufacturing. Intel was stuck on its heavily ...

Intel is reportedly still struggling with a chipmaking process crucial to its future. Reuters reports that the company's 18A process is still producing low yields and high defect rates. Intel has ...

Intel's 18A process is built around the Backside Power Delivery Network, or BSPDN, a structural overhaul known inside Intel as PowerVia. Instead of routing power through ...

TL;DR: Intel's 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA ...

Intel claims its Intel 18A process delivers major performance and efficiency gains over Intel 3. The company still needs to scale up the process with acceptable yields, but the numbers are looking ...

The chip was designed as part of Europe's broader effort to reduce reliance on non-European processor technologies.

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TL;DR: Intel Foundry's future hinges on securing major clients for its advanced Intel 14A process, featuring second-gen RibbonFET and PowerDirect technologies. Rumors suggest Apple and NVIDIA may ...

The key to Intel's (NASDAQ: INTC) turnaround is the Intel 18A manufacturing process, the final process in the company's original five-nodes-in-four-years plan. Intel will not only make Intel 18A ...