Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.
CRN

AMD’s New Embedded CPUs Go After Intel On Performance, Energy Use And Size

With AMD marketing the chips for AI networking, storage and industrial edge use cases, the company claims that the new EPYC Embedded 2005 CPUs provide a balance of compute, energy efficiency and I/O ...
The Herald News

congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

Intel gains on reports SK Hynix partnership could boost chip-packaging business

Shares of Intel (INTC) rose on Monday amid growing optimism that the chipmaker could secure a significant new customer for its semiconductor packaging technology, strengthening investor confidence in ...
Morningstar

DFI to Showcase Edge AI Platforms, Powered by Intel, for Robotic Automation and Industrial Applications at Embedded World 2026

TAIPEI, March 9, 2026 /PRNewswire/ -- DFI, a global provider of industrial computers, embedded motherboards and edge computing platforms, said it will showcase application-driven edge AI platforms-- ...
DIGITIMES

Embedded substrates draw AI chip interest as packaging turns strategic

Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity and power stability ...